Silicon

Total Solution Provider

Silicon

Our company’s flagship products are silicon-parts for semiconductors which are mainly used for etching processes in the entire semiconductor process.
Our key products include Electrodes (Cathode, GDP (Gas Distribution Plates), GSP (Gas Shower Plates, etc.) and Rings.

Production and Sales System

Our company established an Integrated Production System which enables Worldex to process more than 90% of Ingots manufactured by WCQ into Si-parts.
These Si-parts are then supplied to the domestic and Chinese market by Worldex, and to the expanding global market including USA, Japan, Singapore, Taiwan, Europe, etc. by our subsidiary, WCQ.

Silicon Ingot

Single Crystal Silicon Ingot Very Large Diameter ingot

Multi-Crystal Silicon “Poly Ingot”

Product Name Single Crystal Silicon Ingot Multi-Crystal Silicon “Poly Ingot”
Application Si Electrode
Si Ring
Si Parts
Si Ring
Si Parts
Characteristic Single Crystal Silicon Ingot Poly Ingot
Purity(%) 99.999999999%(11N) 99.9999999%(9N)
Diameter Ø215~Ø600mm Customer Specification
Length 1300~400mm 1000~800mm
Direction <100>, <110>, <111> Columnar
Type P type, Boron Doped P type, Boron Doped
Resistance 0.001~1000 Ω-Cm 0.001~1000 Ω-Cm
Oxygen Content(ppma) ≤ 20 ppma ≤ 20 ppma
Carbon Content(ppma) ≤ 0.3 ppma ≤ 0.3 ppma

Silicon Electrode

Silicon Electrode

Silicon Electrode

Product Name Silicon Electrode
Product Description Role of producing Plasma state through Gas Flow
Application Etcher
Product Type Si Electrode, Shower Head, Cel Inner
Raw Material Single Crystal Silicon
External Diameter Ø600max
Resistance Low resistance < 0.1ohm.cm
General resistance 1~20ohm.cm
High resistance 60~90ohm.cm
Electrode Hole Diameter 0.4~1.0
Roundness
Concentricity 0.01
Surface Processing Etching, Polishing, Lapping, Cleaning
Flatness 0.01
Processing Precision 0.05

Silicon Ring

Silicon Ring

Silicon Ring

Product Name Silicon Ring
Product Description Role of concentrating Plasma generated from Electrode to correct position
Application Etcher
Product Type Role of concentrating Plasma generated from Electrode to correct position
Raw Material Single Crystal Silicon, Poly Si, CVD SiC
External Diameter Ø600 Max
Resistance Low resistance < 0.1ohm.cm
General resistance 1~20ohm.cm
Electrode Hole Diameter
Roundness
Concentricity error
Surface Processing Polishing, Lapping, Grinding
Flatness 0.01
Processing Precision 0.05

Silicon others

Silicon Boat

Silicon other parts

Product Name Silicon Boat Silicon other parts
Product Description Container for transporting and storing of wafer in the semiconductor manufacturing process Wafer, Plate, Pin, Tube, etc.
Application Used in various semiconductor manufacturing processes including CVD, thermal oxidation and diffusion, and ion injection, etc. Parts for semiconductor process including Epi, etc.
Type Vertical and Horizontal types Customized manufacturing and production